Supply chain / Packaging
Advanced packaging capacity (CoWoS)
Packaging dies and HBM together is a distinct manufacturing step, and trade press reports it has limited how many AI accelerators can be finished.
- Type
- Reported constraint
- Where it sits
- Limits how fast accelerator supply can grow, which affects availability of GPU capacity downstream.
- Constraint
- Reported in September 2026 that advanced packaging is a limiting factor in AI chip production, with TSMC reportedly planning to roughly double CoWoS capacity by 2028.
What we checked
- Digital Citizen reported on 12 September 2026 that TSMC planned to grow CoWoS capacity from about 130,000 to about 260,000 wafers a month by end of 2028 (reported, not confirmed by TSMC in the source). (source)
- In July 2024 TSMC's chair said AI was driving strong demand for CoWoS and that TSMC was working with outsourced assembly and test firms to meet orders. (source)
Written by ComputeFinder from public pages on 2 October 2026. Company statements are the company's own, not independently checked, and reported items are marked as such. Not yet reviewed line by line by a second person. If something is wrong, tell us.