Supply chain / Packaging
TSMC 3DFabric and CoWoS packaging
CoWoS is TSMC's packaging technology for joining processor dies and memory on one carrier, part of its 3DFabric family alongside InFO and SoIC.
- Type
- Technology
- Where it sits
- Packaging step that turns an accelerator die and its HBM stacks into a usable part.
- Constraint
- See the advanced packaging bottleneck entry.
What we checked
- TSMC describes CoWoS as its packaging option for high-performance computing, with InFO aimed at mobile and network uses and SoIC for vertical chiplet stacking. (source)
Written by ComputeFinder from public pages on 2 October 2026. Company statements are the company's own, not independently checked, and reported items are marked as such. Not yet reviewed line by line by a second person. If something is wrong, tell us.